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IBM HEAT SINK (VAPOR CHAMBER), REAR MICROPROCESSOR (USE WITH 135 W MICROPROCESSORS) FOR FLEX SYSTEM

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IBM HEAT SINK (VAPOR CHAMBER), REAR MICROPROCESSOR (USE WITH 135 W MICROPROCESSORS) FOR FLEX SYSTEM
46,87 € *

inkl. MwSt. zzgl. Versandkosten

Qualität

  • 81Y4327-3
  • 4053162928954
IBM HEAT SINK (VAPOR CHAMBER), REAR MICROPROCESSOR (USE WITH 135 W MICROPROCESSORS) FOR FLEX... mehr
IBM HEAT SINK (VAPOR CHAMBER), REAR MICROPROCESSOR (USE WITH 135 W MICROPROCESSORS) FOR FLEX SYSTEM X240 COMPUTE NODE (7863, 8737)